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그림1. The polydimethylsiloxane (PDMS)-based fabrication procedures for 2D-planarized chip arrays for post-processing [1]
[1] A-H. Lee, J. Lee, F. Laiwalla, V. Leung, J. Huang, A. Nurmikko, Y-K. Song, "A Scalable and Low Stress Post-CMOS Processing Technique for Implantable Microsensors" Micromachines, 2020.